The magnetic flap level gauge instrument can be used for medium level detection of various towers, tanks, tanks, spherical vessels and boilers. This series of liquid level gauges can achieve high sealing, anti-leakage and suitable for high temperature, high pressure, corrosion-resistant occasions. It compensates for defects such as poor visibility of the glass plate (tube) liquid level gauge, easy to break, etc., and the whole process of measurement has no blind area, the display is clear, and the measurement range is large.
The malfunction of the instrument will happen more or less, and the operation will be proper and the maintenance will be less. When the magnetic level gauge malfunctions, we must first carefully observe and carefully analyze the cause to make a correct judgment. About the magnetic flip level gauge fault analysis We can consider the following options, simple and clear:
1, observation method. Uses sight, smell, touch. In some cases, the damaged components will discolor, blistering, or burn spots; burned devices will produce some special odors; short-circuited chips will become hot; visible or unwelded areas can also be observed with the naked eye. . This method is more suitable for experienced staff.
2, elimination method. The method of determining the cause of the fault is determined by plugging and unplugging some plug-in boards and devices. When the instrument returns to normal after removing a certain board or device, it indicates that the failure occurred.
3, replacement method. Two instruments with the same type of remote magnetic level gauge or sufficient spare parts are required. Replace a good spare with the same component on the faulty machine and see if the fault is eliminated.
4, the contrast method. Two instruments of the same type are required, and a magnetic float level gauge is in normal operation. Use this method also has the necessary equipment, for example, multimeter, oscilloscope and so on. According to the nature of comparison, there are voltage comparison, waveform comparison, static impedance comparison, output comparison, and current comparison.
5, parallel method. Place a good IC chip on the chip to be inspected, or connect good components (resistance capacitors, diodes, transistors, etc.) in parallel with the components to be inspected and maintain good contact if the fault is caused by an open circuit inside the device or For poor contact and other reasons, this method can be ruled out.
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